1. 　Introduction
Owing to the inter-net and telecommunication industry growing rapidly and prosperously, IT industry get into new developing stage. In addition to software requirement, the technologies of IT hardware also need to enhance it.
Furthermore, the highly integrated LSI (large-scale integration) and the development of systematic LSI strengthen the function of electronic machines. Regarding to the different requirement of electric circuit, now it goes toward high density and mini-scale scope. In order to assemble the electronic machines on high density and mini-scale, the manufacturing of printed circuit board must be selected for the minute circuit technology, so the sales of multi-layer circuit board share the market more and more. Recently PCB manufacturing by build-up process is more popular than ever.
In this proposal we will introduce the process of motherboard manufacturing also the request of equipment for investment reference.

2. 　General Processing Information
2.1 　Flow Chart


2.2 　Process Description
2.2.1 Issue material
Because of the variety of printed circuit board, the finished size of the CCL is all in full size. The main purpose of this step is sizing to match the processing.
2.2.2 Inner layer
The main job was finishing the first layer and second layer, the main process was made by exposure, developing and etching.
2.2.3 Black oxide
When the inner layer etching finished, to make the quality of adhesive better and stronger, the inner layer will soak in one kind of chemical solution to produce the CuO, the reason is to make the surface rough and to gain the better adhesive.
2.2.4 MLB lam.
The main purpose of this step is to melt the prepreg，after increasing the temperature and pressure, the copper foil and glass fiber will adhere closely.
Presently, in order to raise the well production ratio, most of the manufactures select vacuum hydraulic press and controllers, which have multi-temperature and pressure control.
2.2.5

2.2.6 Drilling
Regarding the position of circuit hole, in addition to plug the electronic component; it also need to connect with inner layer and out-layer.
2.2.7 Desmear & deburr
When the board drilling finished, it will appear much more trash and burr, cleaning and brushing process are necessary.
2.2.8 Eless Cu (PTH)
To plate the hole of PCB with copper and to connect it up and down for electricity.
2.2.9 Outlet dry film
The forming of outlet dry film is opposite to the forming of inner layer.
Regarding the photograph, inner layer is referred to positive and outlet dry film as the negative.
2.2.10 Pattern plate
Plating the through hole thicker.
2.2.11 Pure tin plating
Plating the tin on the wire to form resistant in etching process.
2.2.12 Etching
Etching the copper outside the resistant by alkaline agent.
2.2.13 Tin stripe
Striping the tin to recover the original copper.
2.2.14 Solder resist
The operation method includes curtain spraying and screen-printing, to distinguish the protected and unprotected area.
2.2.15 Legend print
Punching the brand and series number on the board, it selects steel-tamp type generally.
2.2.16 Cleaning
2.2.17 OQC/Baking/Packing

3. 　Plant Description
3.1 　Production capacity
30000 feet square/month
Calculation Process: 300mm*400mm=1.8526 feet square
12(one open 12 pieces) X6 (pieces) X7 (7 recycle/per day) X2 (2hot) X24 (operation days) =44818 feet square

3.2 　Raw Materials

Glass-fiber cloth	Chemical solution
Copper foil	Dry film
Paper
Steel plate
Carriage
Cover plate
Adhesive gel

3.3 　Machines and Equipments
3.3.1 Pre-process

Equipment

CAM SYSTEM

PLOTTER

Art-work

Art work development

Art work coordinate hole puncher

Art work inspector

Art work protect membrane

Artwork cleaning machine

3.3.2 Inner layer

Equipment

Cooper clad laminate

Sizing

Membrane lamination

CCD type exposure

development、etching、elimination

Black oxide

Dry

3.3.3 Built –up

Equipment

Cooper foil sizing

PP (PREPREG)

PP sizing

Vacuum hydraulic press Conveyor line Boil vapor Steel plate brush line Steel plate

Puncher

Shear and cutting

CNC drilling machining center Drill bit renew Drilling cushion Drilling hole check

3.3.4 Wet process

Equipment

Desmear

PTH & PNL plate

development、etching、stripe、cleaning

Dry

3.3.5 tin plate(vertical type)、etching、tin stripe SES LINE.
3.3.6 Solder resist
CURTAIN COATING / ROLLER COATING
3.3.7 Tin Hot air leveling
3.3.8 Legend printing
3.3.9 CNC Router
3.3.10 Fly needle inspection or AOI
3.3.11 Cleaning machine
3.3.12 Inspection
3.3.13 Drying
3.3.14 Packaging

3.4 　Manpower Requirement
Total manpower requirement is about 600 ~ 700 persons including: general manager, division manager, production technician, foreman, machines operator, general worker, etc. R&D department is exclusive.

3.5　 Electricity Power Requirement
Electricity Power：220V / 3Ph / 60Hz

3.6 　Total Budget
The total budget for turnkey machines and equipments procurement is about USD 50 millions under the production capacity mentioned above.

3.7　 Plant Layout
Owing to the evolution of processing method proceed continuously; the allocation diagram below is only for reference. Because some process claimed dust-free, so we show the ordinary allocation.